IC/transistor sockets

Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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CoreStaff Part Number		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
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04-0503-31
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0503-31-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
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04-0508-20
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0508-20-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 4 (1 x 4) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-0508-21
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0508-21-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 4 (1 x 4) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-0508-30
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0508-30-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 4 (1 x 4) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-0508-31
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0508-31-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 4 (1 x 4) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-0511-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-0511-10-ND@0

Aries Electronics 511 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C - Through Hole Tin Tin 50.0µin (1.27µm) 50.0µin (1.27µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0511-11
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0511-11-ND@0

Aries Electronics 511 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-0513-10

04-0513-10
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0513-10-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-0513-10H

04-0513-10H
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0513-10H-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0513-10T

04-0513-10T
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0513-10T-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0513-11
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0513-11-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0513-11H
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0513-11H-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0517-90C
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4 (1 x 4) Pos SIP Socket Gold Through Hole, Right Angle
CoreStaff Part Number：zp2216-04-0517-90C-ND@0

Aries Electronics 0517 SIP - - 4 (1 x 4) Solder - - Through Hole, Right Angle Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0518-00
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4 (1 x 4) Pos SIP Socket Gold Surface Mount
CoreStaff Part Number：zp2216-04-0518-00-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - Open Frame Surface Mount Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0518-10
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0518-10-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0518-10H
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0518-10H-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0518-10T
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0518-10T-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-0518-11
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0518-11-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-0518-11H
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4 (1 x 4) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-0518-11H-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-1508-20
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1508-20-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-1508-21
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1508-21-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-1508-30
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1508-30-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-1508-31
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1508-31-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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04-1518-00
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Surface Mount
CoreStaff Part Number：zp2216-04-1518-00-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder - Open Frame Surface Mount Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-1518-10
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1518-10-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-1518-10H
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1518-10H-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-1518-10T
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1518-10T-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-1518-11
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1518-11-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-1518-11H
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4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-1518-11H-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-3513-11
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4 (2 x 2) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-3513-11-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-3513-11H
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4 (2 x 2) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-04-3513-11H-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 4 (2 x 2) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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04-71000-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-71000-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7350-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7350-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7360-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7360-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7375-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7375-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7380-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7380-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7400-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7400-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7422-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7422-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7425-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7425-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7430-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7430-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7445-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7445-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7482-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7482-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7500-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7500-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7533-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7533-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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04-7545-10
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4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7545-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7550-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

View Details

4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7550-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7560-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

View Details

4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7560-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7700-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

View Details

4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7700-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7755-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

View Details

4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7755-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

04-7800-10
ARIES ELECTRONICS

RoHS

Certified
in Japan

   

View Details

4 (1 x 4) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-04-7800-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 4 (1 x 4) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled

Recommended Rectifiers - IC/transistor sockets