Manufacturer Series Pitch - Post Pitch - Mating Number of Pins Convert From (Adapter End) Convert To (Adapter End) Termination Mounting Type Contact Finish - Post Contact Finish - Mating Housing Material Board Material

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核友管理編號		 Manufacturer Series Pitch - Post Pitch - Mating Number of Pins Product Overview Convert From (Adapter End) Convert To (Adapter End) Termination Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Housing Material Board Material
Partner Stock

20-665000-00
ARIES ELECTRONICS

   

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IC Socket Adapter SOIC-W To SOIC Surface Mount
核友型號：zp2216-20-665000-00-ND@0

Aries Electronics Correct-A-Chip® 665000 0.050" (1.27mm) 0.050" (1.27mm) 20 SOIC-W SOIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

20-666000-00
ARIES ELECTRONICS

   

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IC Socket Adapter SOIC To SOWIC Surface Mount
核友型號：zp2216-20-666000-00-ND@0

Aries Electronics Correct-A-Chip® 666000 0.050" (1.27mm) 0.050" (1.27mm) 20 SOIC SOWIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

200-4660-14-1900
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Connector Plug For 3M™ PGA Sockets
核友型號：zp2216-3M5075-ND@0

3M - Plug 3M™ PGA Sockets - - - -
Partner Stock

2040865-1
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Backplate and Lever Kit For LGA1366 Sockets
核友型號：zp2216-2040865-1-ND@0

TE Connectivity AMP Connectors - Backplate and Lever Kit LGA1366 Sockets - - - -
Partner Stock

2069190-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Actuation Mechanism For LGA G34 Sockets
核友型號：zp2216-A108315-ND@0

TE Connectivity AMP Connectors - Actuation Mechanism LGA G34 Sockets - - - -
Partner Stock

2134439-2

2134439-2
TE CONNECTIVITY AMP CONNECTORS

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Connector ILM Assembly For LGA 2011 Connectors
核友型號：zp2216-A108323-ND@0

TE Connectivity AMP Connectors - ILM Assembly LGA 2011 Connectors Cover - Silver Stainless Steel
Partner Stock

214-3339-09-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M1401-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 14 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

214-3339-19-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M5013-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 14 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

216-3340-09-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M1601-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 16 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

216-3340-19-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M5014-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 16 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

218-3341-19-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M5015-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 18 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

21PTC01031

21PTC01031
ESSENTRA COMPONENTS

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Connector Cover For TO-3, TO-66
核友型號：zp2216-145-21PTC01031-ND@0

Essentra Components - Cover TO-3, TO-66 - - White, Off Polyamide (PA66), Nylon 6/6
Partner Stock

22-665000-00
ARIES ELECTRONICS

   

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IC Socket Adapter SOIC-W To SOIC Surface Mount
核友型號：zp2216-22-665000-00-ND@0

Aries Electronics Correct-A-Chip® 665000 0.050" (1.27mm) 0.050" (1.27mm) 22 SOIC-W SOIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

22-666000-00
ARIES ELECTRONICS

   

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IC Socket Adapter SOIC To SOWIC Surface Mount
核友型號：zp2216-22-666000-00-ND@0

Aries Electronics Correct-A-Chip® 666000 0.050" (1.27mm) 0.050" (1.27mm) 22 SOIC SOWIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

220-3342-09-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M2001-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 20 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

220-3342-19-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M5016-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 20 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
核友型號：zp2216-19-222-3343-09-0602J-ND@0

3M - 0.100" (2.54mm) 0.100" (2.54mm) 22 DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

222-3343-19-0602
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IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
核友型號：zp2216-19-222-3343-19-0602-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 22 DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-09-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M2401-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-19-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5018-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-29-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5019-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-1275-39-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5020-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-5248-09-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M5021-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

224-5248-19-0602J
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型號：zp2216-3M5022-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-09-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M2801-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-19-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3937-228-1277-19-0602J-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-19-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5023-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-29-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5024-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-1277-39-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5025-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

228-4817-09-0602J
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IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole
核友型號：zp2216-3M5028-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 28 DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

2299804-1

2299804-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Bolster Assembly For LGA 3647 Sockets
核友型號：zp2216-A125205-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets Cover - Silver Stainless Steel
Partner Stock

2299804-3

2299804-3
TE CONNECTIVITY AMP CONNECTORS

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Connector Bolster Assembly For LGA 3647 Sockets
核友型號：zp2216-A125208-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets - - Silver Stainless Steel
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2299805-1

2299805-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Backplate For LGA 3647 Sockets
核友型號：zp2216-A125206-ND@0

TE Connectivity AMP Connectors - Backplate LGA 3647 Sockets - Nickel Silver Steel
Partner Stock

2299805-3

2299805-3
TE CONNECTIVITY AMP CONNECTORS

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Connector Backplate For LGA 3647 Sockets
核友型號：zp2216-A125210-ND@0

TE Connectivity AMP Connectors - Backplate LGA 3647 Sockets - Nickel Silver Steel
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2299806-1

2299806-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Carrier For LGA 3647 Sockets
核友型號：zp2216-A125207-ND@0

TE Connectivity AMP Connectors - Carrier LGA 3647 Sockets - - Black Thermoplastic
Partner Stock

2305234-1

2305234-1
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Cover For LGA 3647 Sockets
核友型號：zp2216-A125209-ND@0

TE Connectivity AMP Connectors - Cover LGA 3647 Sockets - - Black Thermoplastic
Partner Stock

2310924-1

2310924-1
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Bolster Assembly For LGA 3647 Sockets
核友型號：zp2216-A125211-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets Cover - Silver Stainless Steel
Partner Stock

2310924-3

2310924-3
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Bolster Assembly For LGA 3647 Sockets
核友型號：zp2216-A125212-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 3647 Sockets - - Silver Stainless Steel
Partner Stock

2310927-1

2310927-1
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Carrier For LGA 3647 Sockets
核友型號：zp2216-A125213-ND@0

TE Connectivity AMP Connectors - Carrier LGA 3647 Sockets - - Black Thermoplastic
Partner Stock

232-1285-09-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型號：zp2216-3M5030-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 32 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -

Recommended Rectifiers - IC/transistor sockets