Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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庫存類別
供應商排名		 供應商 庫存所在位置 照片 型號 / 製造商 / 其他 庫存量 生產年份/批號 單價 最低訂貨數量 /
後續訂購數量		 預定出貨日 ECAD模型 資訊
核友管理編號		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock

XR2A-2011-N
5

MOQ : 3
SPQ : 1

Detail

核友型號：st61431223

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
5

MOQ : 4
SPQ : 1

Detail

核友型號：st61431224

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
海外位置
RoHS
10

MOQ : 3
SPQ : 1

Detail

核友型號：st50002590

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 24（2 x 12） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock

XR2A-2811-N
15

MOQ : 3
SPQ : 1

Detail

核友型號：st61431226

Omron Electronics Inc-EMC Div XR2 15.24 mm
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
海外位置
RoHS
1

MOQ : 1
SPQ : 1

Detail

核友型號：st50002591

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
海外位置
RoHS
5

MOQ : 2
SPQ : 1

Detail

核友型號：st50002592

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
4

MOQ : 2
SPQ : 1

Detail

核友型號：st61431227

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
1

MOQ : 1
SPQ : 1

Detail

核友型號：st61431228

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 10（1 x 10） Solder -55°C～125°C High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits. Threaded Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
1

MOQ : 1
SPQ : 1

Detail

核友型號：st61431229

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Closed Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
海外位置

XR2C-3211-N
RoHS
5

MOQ : 2
SPQ : 1

Detail

核友型號：st50002593

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
海外位置

XR2P-1041
OMRON

RoHS
4

MOQ : 2
SPQ : 1

Detail

核友型號：st50002594

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 10（1 x 10） Solder -55°C～125°C High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits. Threaded Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2 		corestaff Hong Kong CoreStaff Thailand stock
海外位置

XR2P-2041

XR2P-2041
OMRON

RoHS
1

MOQ : 1
SPQ : 1

Detail

核友型號：st50002595

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits. Threaded Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
庫存類別
供應商排名		 供應商 庫存所在位置 照片 型號 / 製造商 / 其他 庫存量 生產年份/批號 單價 最低訂貨數量 /
後續訂購數量		 預定出貨日 ECAD模型 資訊
核友管理編號		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
质量保证库存
質量保證
B-1 		來自供應商的訂
30  

核友型號：st65482341

質量保證
B-1 		來自供應商的訂

1-2199298-2
TE CONNECTIVITY

200 22+  

核友型號：st75023655

TE Connectivity Diplomate DL DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 8（2 x 4） Solder -40°C～105°C Open Frame Through Hole Tin Tin 60.0μin（1.52μm） Brass/Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		來自供應商的訂

1-2324271-3
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

核友型號：st72738096

質量保證
B-1 		來自供應商的訂

1-2324271-4
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

核友型號：st72738097

TE Connectivity LGA 4189 0.034inches（0.86mm） 0.039inches（1.00mm） 2092 Solder -25°C～100°C Open Frame Surface Mount Gold Gold 15.0μin（0.38μm） 15.0μin（0.38μm） Copper Alloy Copper Alloy Thermoreversible
質量保證
B-1 		來自供應商的訂

1-390261-3
TE CONNECTIVITY

4,066  

核友型號：st72143737

質量保證
B-1 		來自供應商的訂

1-822473-7
TE CONNECTIVITY

76  

核友型號：st72143764

質量保證
B-1 		來自供應商的訂
413 19  

核友型號：st65329491

MILL-MAX 110 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 8（2 x 4） Solder -55°C～125°C Open Frame Through Hole Tin Gold 200.0μin（5.08μm） 30.0μin（0.76μm） Brass Alloy Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
質量保證
B-1 		來自供應商的訂

110-87-628-41-001101
139 NO INFO  

核友型號：st65282553

PRECI-DIP 110 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Solder -55°C～125°C Open Frame Through Hole Tin Gold Flash Brass Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester、ガラス充填
質量保證
B-1 		來自供應商的訂

2-2330550-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

核友型號：st70632473

質量保證
B-1 		來自供應商的訂

2-2330551-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

核友型號：st70632474

質量保證
B-1 		來自供應商的訂

2-2330553-1
TE CONNECTIVITY

1,600   MOQ : 32
SPQ : 1

核友型號：st70632476

質量保證
B-1 		來自供應商的訂

2-5916783-5
TE CONNECTIVITY

360 2012  

核友型號：st75013303

質量保證
B-1 		日本供應商
40 2013  

核友型號：st47622433

3M Textool? DIP、ZIF（ZIP）、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Press Fit -55°C～125°C Closed Frame Connector Gold Gold 30.0μin（0.76μm） 30.0μin（0.76μm） Beryllium Copper Beryllium Copper Polysulfone (PSU), glass filled
質量保證
B-1 		來自供應商的訂

4-1571551-9
TE CONNECTIVITY

209 NO INFO  

核友型號：st65283399

質量保證
B-1 		來自供應商的訂
20  

核友型號：st65485092

質量保證
B-1 		來自供應商的訂

A81-A600X
SIEMENS

70 99  

核友型號：st65401253

SIEMENS
質量保證
B-1 		來自供應商的訂

D01-9972042

D01-9972042
HARWIN

280 NO INFO  

核友型號：st65285034

HARWIN D01-997 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Through Hole Tin Gold 196.9μin（5.00μm） Flash Brass Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester、ガラス充填
質量保證
B-1 		來自供應商的訂

PM-10
MAC8

4  

核友型號：st63530587

MAC8
質量保證
B-1 		日本供應商

XR2A-0801-N
10 2010  

核友型號：st30382437

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
2 2019  

核友型號：st42720655

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商

XR2A-1611-N
5  

核友型號：st31354538

Omron Electronics Inc-EMC Div XR2 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 16（2 x 8） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供應商

XR2A-1611-N
18 2007  

核友型號：st30353636

Omron Electronics Inc-EMC Div XR2 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 16（2 x 8） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供應商

XR2A-1621-N
42 2005  

核友型號：st30353637

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
2 2017  

核友型號：st39999247

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
10 2008  

核友型號：st30353638

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商

XR2A-2011-N
56 2002  

核友型號：st30353639

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
45 2006  

核友型號：st30353641

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 24（2 x 12） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供應商
34 2005  

核友型號：st30353642

Omron Electronics Inc-EMC Div XR2 15.24 mm
質量保證
B-1 		來自供應商的訂
3 2005  

核友型號：st60018582

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
30 2005  

核友型號：st30353645

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供應商
50 2011  

核友型號：st30353646

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
3 2008  

核友型號：st30353647

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
300  

核友型號：st30382442

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供應商
1 2017  

核友型號：st30382443

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		來自供應商的訂
500 2018  

核友型號：st60028544

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Closed Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供應商
1 2016  

核友型號：st39999248

Omron Electronics Inc-EMC Div XR2 15.24 mm
授權代理店
A-1 		來自供應商的訂

1825046-2
TE CONNECTIVITY

40  

核友型號：st62535567

授權代理店
A-1 		來自供應商的訂

643648-1
TE CONNECTIVITY

138  

核友型號：st68855655

Recommended Rectifiers - IC/transistor sockets