Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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หมายเลขการจัดการของคอร์สตาฟ		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
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06-3513-11
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3513-11-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3513-11H
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3513-11H-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-00
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount
CoreStaff Part Number：zp2216-06-3518-00-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Surface Mount Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-01
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-01-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-10
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-10-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-10E
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-10E-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-10H
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-10H-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-10M
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-10M-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-10T
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-10T-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-11
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-11-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3518-11H
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-3518-11H-ND@0

Aries Electronics 518 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6503-20
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6503-20-ND@0

Aries Electronics 503 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6503-30
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6503-30-ND@0

Aries Electronics 503 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6503-31
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6503-31-ND@0

Aries Electronics 503 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6513-10
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6513-10-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6513-10H
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6513-10H-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6513-10T
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6513-10T-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6513-11
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6513-11-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6513-11H
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-6513-11H-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6820-90C
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CoreStaff Part Number：zp2216-06-6820-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole, Right Angle, Horizontal Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6822-90C
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CoreStaff Part Number：zp2216-06-6822-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole, Right Angle, Horizontal Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-6823-90C
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6 (2 x 3) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CoreStaff Part Number：zp2216-06-6823-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole, Right Angle, Horizontal Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-71187-10
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6 (1 x 6) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-06-71187-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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06-7360-10
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6 (1 x 6) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-06-7360-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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06-7425-10
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6 (1 x 6) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-06-7425-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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06-7755-10
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6 (1 x 6) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-06-7755-10-ND@0

Aries Electronics 700 Elevator Strip-Line™ SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder -55°C ~ 105°C Elevated Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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06-810-90C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole, Right Angle, Vertical
CoreStaff Part Number：zp2216-06-810-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Closed Frame Through Hole, Right Angle, Vertical Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-81000-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-81000-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-81140-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-81140-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-81250-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-81250-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-820-90C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CoreStaff Part Number：zp2216-06-820-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole, Right Angle, Horizontal Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-822-90C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CoreStaff Part Number：zp2216-06-822-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole, Right Angle, Horizontal Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-823-90C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal
CoreStaff Part Number：zp2216-06-823-90C-ND@0

Aries Electronics Vertisockets™ 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole, Right Angle, Horizontal Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-8285-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-8285-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-8300-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-8300-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-8590-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-8590-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-8950-310C
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-8950-310C-ND@0

Aries Electronics 8 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame, Elevated Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-9513-10T
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6 (2 x 3) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole
CoreStaff Part Number：zp2216-06-9513-10T-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.9" (22.86mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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07-0501-20
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7 (1 x 7) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-07-0501-20-ND@0

Aries Electronics 501 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap -55°C ~ 105°C - Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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07-0501-21
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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0501-21-ND@0

Aries Electronics 501 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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07-0501-30
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7 (1 x 7) Pos SIP Socket Tin Through Hole
CoreStaff Part Number：zp2216-07-0501-30-ND@0

Aries Electronics 501 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap -55°C ~ 105°C - Through Hole Tin Tin 200.0µin (5.08µm) 200.0µin (5.08µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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07-0501-31
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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0501-31-ND@0

Aries Electronics 501 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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07-0503-20
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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0503-20-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
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07-0503-21
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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0503-21-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

07-0503-30
ARIES ELECTRONICS

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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0503-30-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

07-0503-31
ARIES ELECTRONICS

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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0503-31-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 7 (1 x 7) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
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07-0508-20
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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0508-20-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 7 (1 x 7) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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07-0508-21
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7 (1 x 7) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-07-0508-21-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 7 (1 x 7) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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08-301296-10
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IC Socket Adapter SOIC To JEDEC Through Hole
CoreStaff Part Number：zp2216-08-301296-10-ND@0

Aries Electronics Correct-A-Chip® 301296 - 0.050" (1.27mm) 8 SOIC JEDEC Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
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08-305479-10
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IC Socket Adapter SOIC To JEDEC Through Hole
CoreStaff Part Number：zp2216-08-305479-10-ND@0

Aries Electronics Correct-A-Chip® 305479 - 0.050" (1.27mm) 8 SOIC JEDEC Solder Through Hole Tin-Lead - - FR4 Epoxy Glass

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