4-1571552-6
TE CONNECTIVITY
Images are for reference only.
Please see Product Specifications
for details.
Documents
Product Specifications
| Category | Connectors/Interfaces IC Sockets |
| Manufacturer | TE CONNECTIVITY |
| Series | 800 |
| Type | DIP、0.3inches（7.62mm）行間隔 |
| Pitch - Post | 0.100inches（2.54mm） |
| Pitch - Mating | 0.100inches（2.54mm） |
| Product Overview | CONN IC DIP SOCKET 20POS GOLD |
| Number of Positions or Pins (Grid) | 20（2 x 10） |
| Termination | Solder |
| Operating Temperature Range | -55°C～105°C |
| Features | Open Frame |
| Mounting Type | Through Hole |
| Contact Finish - Post | Gold |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Post | 20.0μin（0.51μm） |
| Contact Finish Thickness - Mating | 20.0μin（0.51μm） |
| Contact Material - Post | Copper |
| Contact Material - Mating | Beryllium Copper |
| Housing Material | Polycyclohexylene dimethylene terephthalate (PCT), polyester |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
