R7FA6M4AD3CBQ#BC0
RENESAS
RoHS Status:PBF
Stock Type:Quality-guaranteed
CoreStaff Part Number:st76599430
Date Code:22/23+
Images are for reference only.
Please see Product Specifications
for details.
Documents
Product Specifications
| ADC Channels (Resolution) | 8 x 12-bit |
| Case/Package | BGA |
| China RoHS | Compliant |
| Core Architecture | ARM Cortex-M33 |
| DAC Channels (Resolution) | 2 x 12-bit |
| Export Control Classification Number (ECCN) Code | 3A991 |
| Part Family | RA |
| Flash Memory Size | 8 kB, 512 kB |
| Frequency | 200 MHz |
| Height | 1.38 mm |
| Harmonized Tariff Schedule (HTS) Code | 8542.31.0001 |
| Interface | CAN, I2C, OSPI, QSPI, SCI, SPI, UART, USBFS |
| Introduction Date | 2024-08-21 |
| Lifecycle Status | Production (Last Updated: 3 weeks ago) |
| Manufacturer Lifecycle Status | ACTIVE (Last Updated: 3 weeks ago) |
| Max Frequency | 200 MHz |
| Max Input Voltage | 3.6 V |
| Max Operating Temperature | 105 °C |
| Max Supply Voltage | 3.6 V |
| Memory Size | 512 kB |
| Memory Type | FLASH |
| Min Input Voltage | 2.7 V |
| Min Operating Temperature | -40 °C |
| Min Supply Voltage | 2.7 V |
| MSL | 3 |
| Mount | Surface Mount |
| Number of I2C Channels | 2 |
| Number of Pins | 64 |
| Number of SPI Channels | 2 |
| Number of UART Channels | 8 |
| Part Group | RA6M4 |
| Peripherals | WDT |
| Pitch | 650 µm |
| RAM Size | 256 kB |
| Part Series | RA6 |
| Target Application | Industrial automation, AI / Edge computing |
| Width | 6 mm |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
In Stock: 2,869
MOQ:100
SPQ:1
