R7F7010253AFP#BA2
RENESAS
Images are for reference only.
Please see Product Specifications
for details.
Product Specifications
Case/Package | LQFP |
Core Architecture | RH850 |
Height | 1.7 mm |
Interface | CAN, I2C, LIN, SPI, UART |
Max Frequency | 80 MHz |
Max Operating Temperature | 105 °C |
Memory Size | 1 MB |
Memory Type | FLASH |
Min Operating Temperature | -40 °C |
Mount | Surface Mount |
Number of I2C Channels | 1 |
Number of Pins | 100 |
Number of SPI Channels | 5 |
Number of UART Channels | 4 |
Oscillator Type | Internal |
RAM Size | 96 kB |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.