ECA1HHG330
Documents
Product Specifications
Capacitance | 33 µF |
Case/Package | Radial |
Contact Plating | Tin |
Diameter | 5 mm |
Dielectric Material | Aluminium |
Dissipation Factor | 12 % |
Height | 12 mm |
Height - Seated (Max) | 11.9888 mm |
Lead/Base Style | Straight |
Lead Diameter | 500 µm |
Lead Free | Lead Free |
Lead Pitch | 2 mm |
Leakage Current | 16.5 µA |
Life (Hours) | 1000 hours |
Lifecycle Status | Production (Last Updated: 4 years ago) |
Max Operating Temperature | 105 °C |
Min Operating Temperature | -55 °C |
Mount | PCB , Through Hole |
Number of Pins | 2 |
Packaging | Bulk |
Radiation Hardening | No |
REACH SVHC | No |
Ripple Current | 90 mA |
Ripple Current (AC) | 90 mA |
Schedule B | 8532220020, 8532220020|8532220020|8532220020|8532220020|8532220020 |
Termination | Radial |
Tolerance | 20 % |
Voltage | 50 V |
Voltage Rating | 50 V |
Voltage Rating (AC) | 50 V |
Voltage Rating (DC) | 50 V |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
In Stock: 808
MOQ:1,650
SPQ:50