Memories

Memory Size Memory Organization Operating Temperature Range
 
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CoreStaff Part Number		 Manufacturer Series Memory Type Memory Format Technology Memory Size Memory Organization Access Time Clock Frequency Interface Supply Voltage Operating Temperature Range Applications Mounting Type Device Package Automotive
Partner Stock

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FLASH - NAND（TLC） メモリ IC 128Gビット eMMC_5.1 200 MHz 153-FBGA（11.5x13）
CoreStaff Part Number：zp2216-3052-FEMC016GBA-T740-ND@0

FLEXXON XTRA VIII Non-Volatile Flash FLASH - NAND (TLC) 128Gbit 16G x 8 200 MHz eMMC_5.1 2.7V ~ 3.6V -40°C ~ 85°C Surface Mount 153-FBGA (11.5x13)
Partner Stock

Certified
in Japan

   

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FLASH - NAND（TLC） メモリ IC 128Gビット eMMC_5.1 200 MHz 153-FBGA（11.5x13）
CoreStaff Part Number：zp2216-3052-FEMC016GBB-T740-ND@0

FLEXXON XTRA VIII Non-Volatile Flash FLASH - NAND (TLC) 128Gbit 16G x 8 200 MHz eMMC_5.1 2.7V ~ 3.6V -40°C ~ 105°C Surface Mount 153-FBGA (11.5x13)
Partner Stock

Certified
in Japan

   

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FLASH - NAND（TLC） メモリ IC 256Gビット eMMC_5.1 200 MHz 153-FBGA（11.5x13）
CoreStaff Part Number：zp2216-3052-FEMC032GBA-T740-ND@0

FLEXXON XTRA VIII Non-Volatile Flash FLASH - NAND (TLC) 256Gbit 32G x 8 200 MHz eMMC_5.1 2.7V ~ 3.6V -40°C ~ 85°C Surface Mount 153-FBGA (11.5x13)
Partner Stock

Certified
in Japan

   

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FLASH - NAND（TLC） メモリ IC 256Gビット eMMC_5.1 200 MHz 153-FBGA（11.5x13）
CoreStaff Part Number：zp2216-3052-FEMC032GBB-T740-ND@0

FLEXXON XTRA VIII Non-Volatile Flash FLASH - NAND (TLC) 256Gbit 32G x 8 200 MHz eMMC_5.1 2.7V ~ 3.6V -40°C ~ 105°C Surface Mount 153-FBGA (11.5x13)

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Recommended Rectifiers - Memories