Manufacturer Series Pitch - Post Pitch - Mating Number of Pins Convert From (Adapter End) Convert To (Adapter End) Termination Mounting Type Contact Finish - Post Contact Finish - Mating Housing Material Board Material

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核友型号		 Manufacturer Series Pitch - Post Pitch - Mating Number of Pins Product Overview Convert From (Adapter End) Convert To (Adapter End) Termination Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Housing Material Board Material
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232-1285-19-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5031-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 32 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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232-1285-29-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5032-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 32 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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2351051-1

2351051-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Back Plate For
核友型号：zp2216-17-2351051-1-ND@0

TE Connectivity AMP Connectors - Back Plate - - - Black -
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2351051-2

2351051-2
TE CONNECTIVITY AMP CONNECTORS

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Connector Back Plate For
核友型号：zp2216-17-2351051-2-ND@0

TE Connectivity AMP Connectors - Back Plate - - - Black -
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24-350000-10-HT
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IC Socket Adapter SOIC To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-24-350000-10-HT-ND@0

Aries Electronics Correct-A-Chip® 350000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Tin-Lead Tin - Polyimide (PI)
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24-351000-10
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IC Socket Adapter SSOP To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-24-351000-10-ND@0

Aries Electronics Correct-A-Chip® 351000 0.100" (2.54mm) 0.026" (0.65mm) 24 SSOP DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
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24-351000-11-RC
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IC Socket Adapter SSOP To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-24-351000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 351000 0.100" (2.54mm) 0.026" (0.65mm) 24 SSOP DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold Gold - FR4 Epoxy Glass
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24-354000-10
ARIES ELECTRONICS

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-24-354000-10-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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24-354000-11-RC
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-24-354000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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24-354000-20
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-24-354000-20-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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24-354000-21-RC
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-24-354000-21-RC-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 24 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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24-35W000-10
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IC Socket Adapter SOIC-W To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-24-35W000-10-ND@0

Aries Electronics Correct-A-Chip® 35W000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC-W DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
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24-35W000-11-RC
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IC Socket Adapter SOIC-W To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-24-35W000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 35W000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC-W DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold - - FR4 Epoxy Glass
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24-650000-10-P
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IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-24-650000-10-P-ND@0

Aries Electronics Correct-A-Chip® 650000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
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24-650000-11-RC

24-650000-11-RC
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IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-A754-ND@0

Aries Electronics Correct-A-Chip® 650000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold - FR4 Epoxy Glass
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24-650000-11-RC-P
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IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-24-650000-11-RC-P-ND@0

Aries Electronics Correct-A-Chip® 650000 0.100" (2.54mm) 0.050" (1.27mm) 24 SOIC DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold - FR4 Epoxy Glass
Partner Stock

24-651000-10
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IC Socket Adapter SSOP To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-24-651000-10-ND@0

Aries Electronics Correct-A-Chip® 651000 0.100" (2.54mm) 0.026" (0.65mm) 24 SSOP DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Tin-Lead - - FR4 Epoxy Glass
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24-665000-00
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IC Socket Adapter SOIC-W To SOIC Surface Mount
核友型号：zp2216-24-665000-00-ND@0

Aries Electronics Correct-A-Chip® 665000 0.050" (1.27mm) 0.050" (1.27mm) 24 SOIC-W SOIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
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24-666000-00
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IC Socket Adapter SOIC To SOWIC Surface Mount
核友型号：zp2216-24-666000-00-ND@0

Aries Electronics Correct-A-Chip® 666000 0.050" (1.27mm) 0.050" (1.27mm) 24 SOIC SOWIC Solder Surface Mount Tin-Lead - - FR4 Epoxy Glass
Partner Stock

240-1280-09-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M4001-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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240-1280-19-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5034-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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240-1280-29-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5035-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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240-1280-39-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5036-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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240-3639-09-0602J
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IC Socket Adapter DIP, 1.0" (25.40mm) Row Spacing To DIP, 1.0" (25.40mm) Row Spacing Through Hole
核友型号：zp2216-3M5037-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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240-3639-19-0602J
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IC Socket Adapter DIP, 1.0" (25.40mm) Row Spacing To DIP, 1.0" (25.40mm) Row Spacing Through Hole
核友型号：zp2216-3M5038-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 40 DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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2405568-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Bolster Assembly For LGA 4710 Sockets
核友型号：zp2216-17-2405568-1-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 4710 Sockets - - Black Thermoplastic, Polyester
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2405568-2
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Bolster Assembly For LGA 4710 Sockets
核友型号：zp2216-17-2405568-2-ND@0

TE Connectivity AMP Connectors - Bolster Assembly LGA 4710 Sockets Cover Nickel Black Stainless Steel
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2405569-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Backplate For LGA 4710 Sockets
核友型号：zp2216-17-2405569-1-ND@0

TE Connectivity AMP Connectors - Backplate LGA 4710 Sockets - Nickel Black Steel
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2405569-2
TE CONNECTIVITY AMP CONNECTORS

   

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Connector Backplate For LGA 4710 Sockets
核友型号：zp2216-17-2405569-2-ND@0

TE Connectivity AMP Connectors - Backplate LGA 4710 Sockets Cover Nickel Black Steel
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2405570-1
TE CONNECTIVITY AMP CONNECTORS

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Connector Carrier For LGA 4710 Sockets
核友型号：zp2216-17-2405570-1-ND@0

TE Connectivity AMP Connectors - Carrier LGA 4710 Sockets - - Gray Acrylonitrile Butadiene Styrene (ABS), Polycarbonate (PC)
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2405570-2
TE CONNECTIVITY AMP CONNECTORS

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Connector Carrier For LGA 4710 Sockets
核友型号：zp2216-17-2405570-2-ND@0

TE Connectivity AMP Connectors - Carrier LGA 4710 Sockets - - Gray Acrylonitrile Butadiene Styrene (ABS), Polycarbonate (PC)
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242-1281-19-0602J
   

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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5040-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 42 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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242-1293-09-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5043-ND@0

3M Textool™ 0.070" (1.78mm) 0.070" (1.78mm) 42 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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248-1282-09-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5045-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 48 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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248-1282-29-0602J
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IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
核友型号：zp2216-3M5047-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 48 DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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251050-001
MACOM TECHNOLOGY SOLUTIONS

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Connector For
核友型号：zp2216-251050-001-ND@0

MACOM Technology Solutions *
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264-1300-09-0602J
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IC Socket Adapter DIP, 0.8" (20.32mm) Row Spacing To DIP, 0.8" (20.32mm) Row Spacing Through Hole
核友型号：zp2216-3M5049-ND@0

3M Textool™ 0.070" (1.78mm) 0.070" (1.78mm) 64 DIP, 0.8" (20.32mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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264-4493-09-0602J
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IC Socket Adapter DIP, 0.9" (22.86mm) Row Spacing To DIP, 0.9" (22.86mm) Row Spacing Through Hole
核友型号：zp2216-3M6401-ND@0

3M Textool™ 0.070" (1.78mm) 0.070" (1.78mm) 64 DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing Solder Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
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264-4493-19-0602J
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IC Socket Adapter DIP, 0.9" (22.86mm) Row Spacing To DIP, 0.9" (22.86mm) Row Spacing Through Hole
核友型号：zp2216-3M5051-ND@0

3M Textool™ 0.100" (2.54mm) 0.100" (2.54mm) 64 DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing Wire Wrap Through Hole Gold Gold Polysulfone (PSU), Glass Filled -
Partner Stock

268-5401-00-0000
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Connector Cover For LCC Sockets
核友型号：zp2216-3MLLSF-ND@0

3M - Cover LCC Sockets - - Silver Aluminum
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268-5401-50-0000
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Connector Cover For LCC Sockets
核友型号：zp2216-3MLLSU-ND@0

3M - Cover LCC Sockets - - Silver Aluminum
Partner Stock

268-5401-52-0000
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Connector Cover For LCC Sockets
核友型号：zp2216-3MLLSH-ND@0

3M - Cover LCC Sockets - - Silver Aluminum
Partner Stock

28-350002-11-RC

28-350002-11-RC
ARIES ELECTRONICS

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IC Socket Adapter SOIC To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-A757-ND@0

Aries Electronics Correct-A-Chip® 350000 0.100" (2.54mm) 0.050" (1.27mm) 28 SOIC DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold - - FR4 Epoxy Glass
Partner Stock

28-350002-11-RC-P
ARIES ELECTRONICS

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IC Socket Adapter SOIC To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-28-350002-11-RC-P-ND@0

Aries Electronics Correct-A-Chip® 350000 0.100" (2.54mm) 0.050" (1.27mm) 28 SOIC DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold - - FR4 Epoxy Glass
Partner Stock

28-354000-10
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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-28-354000-10-ND@0

Aries Electronics Correct-A-Chip® 354000 0.050" (1.27mm) 0.100" (2.54mm) 28 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
Partner Stock

28-354000-11-RC
ARIES ELECTRONICS

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-28-354000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 354000 0.100" (2.54mm) - 28 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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28-354000-20
ARIES ELECTRONICS

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-28-354000-20-ND@0

Aries Electronics Correct-A-Chip® 354000 0.100" (2.54mm) - 28 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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28-354000-21-RC
ARIES ELECTRONICS

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IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To SOIC Surface Mount
核友型号：zp2216-28-354000-21-RC-ND@0

Aries Electronics Correct-A-Chip® 354000 0.100" (2.54mm) - 28 DIP, 0.3" (7.62mm) Row Spacing SOIC Solder Surface Mount Gold Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
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28-35W000-11-RC
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IC Socket Adapter SOIC-W To DIP, 0.3" (7.62mm) Row Spacing Through Hole
核友型号：zp2216-28-35W000-11-RC-ND@0

Aries Electronics Correct-A-Chip® 35W000 0.050" (1.27mm) - 28 SOIC-W DIP, 0.3" (7.62mm) Row Spacing Solder Through Hole Gold - - FR4 Epoxy Glass
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28-450001-10
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IC Socket Adapter SOJ To DIP, 0.4" (10.16mm) Row Spacing Through Hole
核友型号：zp2216-28-450001-10-ND@0

Aries Electronics Correct-A-Chip® 450001 0.100" (2.54mm) 0.050" (1.27mm) 28 SOJ DIP, 0.4" (10.16mm) Row Spacing Solder Through Hole - - - FR4 Epoxy Glass

Recommended Rectifiers - IC/transistor sockets