Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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ดาวน์โหลดผลการค้นหา (Excel File)

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หมายเลขการจัดการของคอร์สตาฟ		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
Quality Guaranteed
B-1 		Supplier Stock

2-2129710-5
TE CONNECTIVITY

1  

CoreStaff Part Number：st75096511

TE Connectivity LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin（0.76μm） Copper Alloy Copper Alloy Thermoreversible
Quality Guaranteed
B-1 		Supplier Stock

2-2129710-6
TE CONNECTIVITY

2  

CoreStaff Part Number：st75096512

TE Connectivity LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin（0.76μm） Copper Alloy Copper Alloy Thermoreversible
Quality Guaranteed
B-1 		Supplier Stock

2-2330550-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

CoreStaff Part Number：st70632473

Quality Guaranteed
B-1 		Supplier Stock

2-2330551-1
TE CONNECTIVITY

1  

CoreStaff Part Number：st75096728

Quality Guaranteed
B-1 		Supplier Stock

2-2330551-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

CoreStaff Part Number：st70632474

Quality Guaranteed
B-1 		Supplier Stock

2-2330553-1
TE CONNECTIVITY

1,600   MOQ : 32
SPQ : 1

CoreStaff Part Number：st70632476

Quality Guaranteed
B-1 		Supplier Stock

2134439-2
TE CONNECTIVITY

4  

CoreStaff Part Number：st75095741

Quality Guaranteed
B-1 		Supplier Stock

2134440-3
TE CONNECTIVITY

4  

CoreStaff Part Number：st75095742

Quality Guaranteed
B-1 		Supplier Stock

2201838-1
TE CONNECTIVITY

3  

CoreStaff Part Number：st75096380

TE Connectivity LGA 0.035inches（0.90mm） 0.040inches（1.02mm） CONN SOCKET LGA 2011POS GOLD 2011（47 x 58） Solder Open Frame Surface Mount Gold Gold 15.0μin（0.38μm） 15.0μin（0.38μm） Copper Alloy Copper Alloy Thermoreversible
Quality Guaranteed
B-1 		Supplier Stock

2201838-2
TE CONNECTIVITY

3  

CoreStaff Part Number：st75096381

Quality Guaranteed
B-1 		Supplier Stock

2287402-1
TE CONNECTIVITY

10  

CoreStaff Part Number：st75096836

TE Connectivity LGA 0.036inches（0.91mm） 0.036inches（0.91mm） 1151 Solder Closed Frame Surface Mount Gold Gold 15.0μin（0.38μm） 15.0μin（0.38μm） Copper Alloy Copper Alloy Thermoreversible
Quality Guaranteed
B-1 		Supplier Stock

2299806-1
TE CONNECTIVITY

6  

CoreStaff Part Number：st75096921

Quality Guaranteed
B-1 		Supplier Stock

3-1571552-6

3-1571552-6
TE CONNECTIVITY

10  

CoreStaff Part Number：st75100181

Quality Guaranteed
B-1 		Supplier Stock

4-1571551-9
TE CONNECTIVITY

209 NO INFO  

CoreStaff Part Number：st65283399

Quality Guaranteed
B-1 		Supplier Stock

4-1571552-2
TE CONNECTIVITY

10  

CoreStaff Part Number：st75102772

TE Connectivity 800 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） CONN IC DIP SOCKET 14POS GOLD 14（2 x 7） Solder -55°C～105°C Open Frame Through Hole Gold Gold 20.0μin（0.51μm） 20.0μin（0.51μm） Copper Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
Quality Guaranteed
B-1 		Supplier Stock

4-1571552-6
TE CONNECTIVITY

17  

CoreStaff Part Number：st75102773

TE Connectivity 800 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） CONN IC DIP SOCKET 20POS GOLD 20（2 x 10） Solder -55°C～105°C Open Frame Through Hole Gold Gold 20.0μin（0.51μm） 20.0μin（0.51μm） Copper Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
Quality Guaranteed
B-1 		Supplier Stock

4-1571552-9
TE CONNECTIVITY

1  

CoreStaff Part Number：st75102774

TE Connectivity 800 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Solder -55°C～105°C Open Frame Through Hole Gold Gold 20.0μin（0.51μm） 20.0μin（0.51μm） Copper Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
Quality Guaranteed
B-1 		Supplier Stock

5-1437535-4
TE CONNECTIVITY

5  

CoreStaff Part Number：st75104667

TE Connectivity 500 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder Closed Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper
Quality Guaranteed
B-1 		Supplier Stock

5-1571552-2

5-1571552-2
TE CONNECTIVITY

3  

CoreStaff Part Number：st75104868

TE Connectivity 800 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 40（2 x 20） Solder -55°C～105°C Open Frame Through Hole Tin-Lead Gold 20.0μin（0.51μm） Copper Alloy Copper Alloy Polyester
Quality Guaranteed
B-1 		Supplier Stock
20  

CoreStaff Part Number：st65485092

Quality Guaranteed
B-1 		Supplier Stock

A81-A600X
SIEMENS

70 99  

CoreStaff Part Number：st65401253

SIEMENS
Quality Guaranteed
B-1 		Supplier Stock

D01-9972042

D01-9972042
HARWIN

280 NO INFO  

CoreStaff Part Number：st65285034

HARWIN D01-997 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Through Hole Tin Gold 196.9μin（5.00μm） Flash Brass Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester、ガラス充填
Quality Guaranteed
B-1 		Japanese Supplier

XR2A-1611-N
18 2007  

CoreStaff Part Number：st30353636

Omron Electronics Inc-EMC Div XR2 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 16（2 x 8） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Japanese Supplier

XR2A-1621-N
42 2005  

CoreStaff Part Number：st30353637

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
Quality Guaranteed
B-1 		Japanese Supplier
10 2008  

CoreStaff Part Number：st30353638

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
Quality Guaranteed
B-1 		Japanese Supplier

XR2A-2011-N
56 2002  

CoreStaff Part Number：st30353639

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
Quality Guaranteed
B-1 		Japanese Supplier
45 2006  

CoreStaff Part Number：st30353641

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 24（2 x 12） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Japanese Supplier
34 2005  

CoreStaff Part Number：st30353642

Omron Electronics Inc-EMC Div XR2 15.24 mm
Quality Guaranteed
B-1 		Supplier Stock
3 2005  

CoreStaff Part Number：st60018582

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
Quality Guaranteed
B-1 		Japanese Supplier
30 2005  

CoreStaff Part Number：st30353645

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Quality Guaranteed
B-1 		Japanese Supplier
50 2011  

CoreStaff Part Number：st30353646

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
Quality Guaranteed
B-1 		Japanese Supplier
3 2008  

CoreStaff Part Number：st30353647

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
Quality Guaranteed
B-1 		Supplier Stock
500 2018  

CoreStaff Part Number：st60028544

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Closed Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
Franchise Stock
A-1 		Supplier Stock

643648-1
TE CONNECTIVITY

138  

CoreStaff Part Number：st68855655

Partner Stock

0009483031
RoHS
   

View Details

3 (Rectangular) Pos Transistor, TO-220 Socket Tin Through Hole
CoreStaff Part Number：zp2216-WM2550-ND@0

Molex - Transistor, TO-220 - - 3 (Rectangular) Solder -40°C ~ 80°C Closed Frame Through Hole Tin Tin 100.0µin (2.54µm) 100.0µin (2.54µm) Brass Brass Polyamide (PA66), Nylon 6/6
Partner Stock

0010182031
RoHS
   

View Details

3 (Rectangular) Pos Transistor, TO-220 Socket Tin Through Hole
CoreStaff Part Number：zp2216-900-0010182031-ND@0

Molex 4038 Transistor, TO-220 0.100" (2.54mm) 0.100" (2.54mm) 3 (Rectangular) Solder - Closed Frame Through Hole Tin Tin 100.0µin (2.54µm) - Brass Brass Polyester, Glass Filled
Partner Stock
RoHS
   

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28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin-Lead Through Hole
CoreStaff Part Number：zp2216-900-0050395288-ND@0

Molex - DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) 28 (2 x 14) - - Closed Frame Through Hole - Tin-Lead - - - - -
Partner Stock

01-0503-20
ARIES ELECTRONICS

RoHS
   

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1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-20-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-21
ARIES ELECTRONICS

RoHS
   

View Details

1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-21-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-30
ARIES ELECTRONICS

RoHS
   

View Details

1 (1 x 1) Pos SIP Socket Gold Through Hole
CoreStaff Part Number：zp2216-01-0503-30-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Tin Gold 30.0µin (0.76µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled

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