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产品属性
| Category | 连接器/接口 IC Sockets |
| Manufacturer | TE CONNECTIVITY |
| Series | 800 |
| Type | DIP、0.3inches（7.62mm）行間隔 |
| Pitch - Post | 0.100inches（2.54mm） |
| Pitch - Mating | 0.100inches（2.54mm） |
| Product Overview | CONN IC DIP SOCKET 20POS GOLD |
| Number of Positions or Pins (Grid) | 20（2 x 10） |
| Termination | Solder |
| Operating Temperature Range | -55°C～105°C |
| Features | Open Frame |
| Mounting Type | Through Hole |
| Contact Finish - Post | Gold |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Post | 20.0μin（0.51μm） |
| Contact Finish Thickness - Mating | 20.0μin（0.51μm） |
| Contact Material - Post | Copper |
| Contact Material - Mating | Beryllium Copper |
| Housing Material | Polycyclohexylene dimethylene terephthalate (PCT), polyester |
・Product description information is provided for convenience to provide an overview of the product.
・Please refer to the data sheet issued by the manufacturer for the relevant official information.
