产品属性
| Case/Package | BGA |
| Contact Plating | Copper, Silver, Tin |
| Core Architecture | ARM |
| Data Bus Width | 32 b |
| Frequency | 1 GHz |
| Height | 1.4 mm |
| Interface | CAN, Ethernet, I2C, SPI, UART, USB |
| Lead Free | Lead Free |
| Lifecycle Status | Production (Last Updated: 1 month ago) |
| Manufacturer Lifecycle Status | ACTIVE (Last Updated: 1 month ago) |
| Max Frequency | 1 GHz |
| Max Junction Temperature (Tj) | 90 °C |
| Max Operating Temperature | 90 °C |
| Max Supply Voltage | 3.465 V |
| Memory Size | 128 kB |
| Memory Type | DDR2, DDR3 |
| Min Operating Temperature | 0 °C |
| Min Supply Voltage | 900 mV |
| Number of ADC Channels | 8 |
| Number of Cores | 1 |
| Number of Ethernet Channels | 2 |
| Number of I2C Channels | 3 |
| Number of Pins | 324 |
| Number of PWM Channels | 3 |
| Number of SPI Channels | 2 |
| Number of UART Channels | 6 |
| Number of USB Channels | 2 |
| Radiation Hardening | No |
| RAM Size | 64 kB |
| REACH SVHC | No |
| Schedule B | 8542310000, 8542310000|8542310000|8542310000|8542310000|8542310000 |
| Thickness | 900 µm |
| Voltage | 1.144 V |
| Weight | 1.713814 g |
| Width | 15 mm |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
