Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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供应商排名		 供应商 库存所在位置 照片 型号 / 制造商 / 其他 库存量 生产批次 单价 最低订货数量 /
后续订购数量		 预定出货日 ECAD模型 资讯
核友型号		 Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
質量保證
B-1 		来自供应商的订

2-2129710-5
TE CONNECTIVITY

1  

Approx. 11 days

核友型号：st75096511

TE Connectivity LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin（0.76μm） Copper Alloy Copper Alloy Thermoreversible
質量保證
B-1 		来自供应商的订

2-2129710-6
TE CONNECTIVITY

2  

Approx. 11 days

核友型号：st75096512

TE Connectivity LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin（0.76μm） Copper Alloy Copper Alloy Thermoreversible
質量保證
B-1 		来自供应商的订

2-2330550-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

Approx. 11 days

核友型号：st70632473

質量保證
B-1 		来自供应商的订

2-2330551-1
TE CONNECTIVITY

1  

Approx. 11 days

核友型号：st75096728

質量保證
B-1 		来自供应商的订

2-2330551-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

Approx. 11 days

核友型号：st70632474

質量保證
B-1 		来自供应商的订

2-2330553-1
TE CONNECTIVITY

1,600   MOQ : 32
SPQ : 1

Approx. 11 days

核友型号：st70632476

質量保證
B-1 		来自供应商的订

2134439-2
TE CONNECTIVITY

4  

Approx. 11 days

核友型号：st75095741

質量保證
B-1 		来自供应商的订

2134440-3
TE CONNECTIVITY

4  

Approx. 11 days

核友型号：st75095742

質量保證
B-1 		来自供应商的订

2201838-1
TE CONNECTIVITY

3  

Approx. 11 days

核友型号：st75096380

TE Connectivity LGA 0.035inches（0.90mm） 0.040inches（1.02mm） CONN SOCKET LGA 2011POS GOLD 2011（47 x 58） Solder Open Frame Surface Mount Gold Gold 15.0μin（0.38μm） 15.0μin（0.38μm） Copper Alloy Copper Alloy Thermoreversible
質量保證
B-1 		来自供应商的订

2201838-2
TE CONNECTIVITY

3  

Approx. 11 days

核友型号：st75096381

質量保證
B-1 		来自供应商的订

2287402-1
TE CONNECTIVITY

10  

Approx. 11 days

核友型号：st75096836

TE Connectivity LGA 0.036inches（0.91mm） 0.036inches（0.91mm） 1151 Solder Closed Frame Surface Mount Gold Gold 15.0μin（0.38μm） 15.0μin（0.38μm） Copper Alloy Copper Alloy Thermoreversible
質量保證
B-1 		来自供应商的订

2299806-1
TE CONNECTIVITY

6  

Approx. 11 days

核友型号：st75096921

質量保證
B-1 		来自供应商的订

3-1571552-6

3-1571552-6
TE CONNECTIVITY

10  

Approx. 11 days

核友型号：st75100181

質量保證
B-1 		来自供应商的订

4-1571551-9
TE CONNECTIVITY

209 NO INFO  

Approx. 10 days

核友型号：st65283399

質量保證
B-1 		来自供应商的订

4-1571552-2
TE CONNECTIVITY

10  

Approx. 11 days

核友型号：st75102772

TE Connectivity 800 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） CONN IC DIP SOCKET 14POS GOLD 14（2 x 7） Solder -55°C～105°C Open Frame Through Hole Gold Gold 20.0μin（0.51μm） 20.0μin（0.51μm） Copper Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
質量保證
B-1 		来自供应商的订

4-1571552-6
TE CONNECTIVITY

17  

Approx. 11 days

核友型号：st75102773

TE Connectivity 800 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） CONN IC DIP SOCKET 20POS GOLD 20（2 x 10） Solder -55°C～105°C Open Frame Through Hole Gold Gold 20.0μin（0.51μm） 20.0μin（0.51μm） Copper Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
質量保證
B-1 		来自供应商的订

4-1571552-9
TE CONNECTIVITY

1  

Approx. 11 days

核友型号：st75102774

TE Connectivity 800 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Solder -55°C～105°C Open Frame Through Hole Gold Gold 20.0μin（0.51μm） 20.0μin（0.51μm） Copper Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
質量保證
B-1 		来自供应商的订

5-1437535-4
TE CONNECTIVITY

5  

Approx. 11 days

核友型号：st75104667

TE Connectivity 500 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder Closed Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper
質量保證
B-1 		来自供应商的订

5-1571552-2

5-1571552-2
TE CONNECTIVITY

3  

Approx. 11 days

核友型号：st75104868

TE Connectivity 800 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 40（2 x 20） Solder -55°C～105°C Open Frame Through Hole Tin-Lead Gold 20.0μin（0.51μm） Copper Alloy Copper Alloy Polyester
質量保證
B-1 		来自供应商的订
20  

Approx. 11 days

核友型号：st65485092

質量保證
B-1 		来自供应商的订

A81-A600X
SIEMENS

70 99  

Approx. 11 days

核友型号：st65401253

SIEMENS
質量保證
B-1 		来自供应商的订

D01-9972042

D01-9972042
HARWIN

280 NO INFO  

Approx. 10 days

核友型号：st65285034

HARWIN D01-997 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Through Hole Tin Gold 196.9μin（5.00μm） Flash Brass Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester、ガラス充填
質量保證
B-1 		日本供应商

XR2A-1611-N
18 2007  

Approx. 4 days

核友型号：st30353636

Omron Electronics Inc-EMC Div XR2 DIP、0.3inches（7.62mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 16（2 x 8） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供应商

XR2A-1621-N
42 2005  

Approx. 4 days

核友型号：st30353637

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供应商
10 2008  

Approx. 4 days

核友型号：st30353638

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供应商

XR2A-2011-N
56 2002  

Approx. 4 days

核友型号：st30353639

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供应商
45 2006  

Approx. 4 days

核友型号：st30353641

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 24（2 x 12） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供应商
34 2005  

Approx. 4 days

核友型号：st30353642

Omron Electronics Inc-EMC Div XR2 15.24 mm
質量保證
B-1 		来自供应商的订
3 2005  

Approx. 4 days

核友型号：st60018582

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供应商
30 2005  

Approx. 4 days

核友型号：st30353645

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches（15.24mm）行間隔 0.100inches（2.54mm） 0.100inches（2.54mm） 28（2 x 14） Solder -55°C～125°C Open Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1 		日本供应商
50 2011  

Approx. 4 days

核友型号：st30353646

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		日本供应商
3 2008  

Approx. 4 days

核友型号：st30353647

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1 		来自供应商的订
500 2018  

Approx. 4 days

核友型号：st60028544

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches（2.54mm） 0.100inches（2.54mm） 20（1 x 20） Solder -55°C～125°C Closed Frame Through Hole Gold Gold 10.0μin（0.25μm） 10.0μin（0.25μm） Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-1 		来自供应商的订

643648-1
TE CONNECTIVITY

138  

Approx. 5 days

核友型号：st68855655

Partner Stock

0009483031
RoHS
   

View Details

3 (Rectangular) Pos Transistor, TO-220 Socket Tin Through Hole
核友型号：zp2216-WM2550-ND@0

Molex - Transistor, TO-220 - - 3 (Rectangular) Solder -40°C ~ 80°C Closed Frame Through Hole Tin Tin 100.0µin (2.54µm) 100.0µin (2.54µm) Brass Brass Polyamide (PA66), Nylon 6/6
Partner Stock

0010182031
RoHS
   

View Details

3 (Rectangular) Pos Transistor, TO-220 Socket Tin Through Hole
核友型号：zp2216-900-0010182031-ND@0

Molex 4038 Transistor, TO-220 0.100" (2.54mm) 0.100" (2.54mm) 3 (Rectangular) Solder - Closed Frame Through Hole Tin Tin 100.0µin (2.54µm) - Brass Brass Polyester, Glass Filled
Partner Stock
RoHS
   

View Details

28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin-Lead Through Hole
核友型号：zp2216-900-0050395288-ND@0

Molex - DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) 28 (2 x 14) - - Closed Frame Through Hole - Tin-Lead - - - - -
Partner Stock

01-0503-20
ARIES ELECTRONICS

RoHS
   

View Details

1 (1 x 1) Pos SIP Socket Gold Through Hole
核友型号：zp2216-01-0503-20-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-21
ARIES ELECTRONICS

RoHS
   

View Details

1 (1 x 1) Pos SIP Socket Gold Through Hole
核友型号：zp2216-01-0503-21-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
Partner Stock

01-0503-30
ARIES ELECTRONICS

RoHS
   

View Details

1 (1 x 1) Pos SIP Socket Gold Through Hole
核友型号：zp2216-01-0503-30-ND@0

Aries Electronics 0503 SIP - - 1 (1 x 1) Wire Wrap - - Through Hole Tin Gold 30.0µin (0.76µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled

Recommended Rectifiers - IC/transistor sockets