Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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库存类别
供应商排名
供应商 库存所在位置 照片 型号 / 制造商 / 其他 库存量 生产批次 单价 最低订货数量 /
后续订购数量
预定出货日 ECAD模型 资讯
核友型号
Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock

XR2A-2011-N

5
3pcs ~  $7.031
30pcs ~  $6.285
150pcs ~  $5.725
300pcs ~  $5.352
1,500pcs ~  $5.277
3,000pcs ~  $5.221


MOQ : 3
SPQ : 1

Detail

Approx. 12 days

核友型号:st61431223

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
5
4pcs ~  $5.082
40pcs ~  $4.802
200pcs ~  $4.242
400pcs ~  $3.869
2,000pcs ~  $3.823
4,000pcs ~  $3.795


MOQ : 4
SPQ : 1

Detail

Approx. 12 days

核友型号:st61431224

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
海外位置
RoHS
10
3pcs ~  $7.94
30pcs ~  $7.194
150pcs ~  $6.634
300pcs ~  $6.261
1,500pcs ~  $6.186
3,000pcs ~  $6.13


MOQ : 3
SPQ : 1

Detail

Approx. 12 days

核友型号:st50002590

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches(15.24mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 24(2 x 12) Solder -55°C~125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock

XR2A-2811-N

15
3pcs ~  $7.51
30pcs ~  $6.763
150pcs ~  $6.203
300pcs ~  $5.83
1,500pcs ~  $5.755
3,000pcs ~  $5.699


MOQ : 3
SPQ : 1

Detail

Approx. 12 days

核友型号:st61431226

Omron Electronics Inc-EMC Div XR2 15.24 mm
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
海外位置
RoHS
1
1pcs ~  $20.092
10pcs ~  $16.359
50pcs ~  $15.613
100pcs ~  $15.053
500pcs ~  $14.679
1,000pcs ~  $14.605


MOQ : 1
SPQ : 1

Detail

Approx. 12 days

核友型号:st50002591

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
海外位置
RoHS
5
2pcs ~  $11.073
20pcs ~  $9.394
100pcs ~  $8.834
200pcs ~  $8.554
1,000pcs ~  $8.461
2,000pcs ~  $8.386


MOQ : 2
SPQ : 1

Detail

Approx. 12 days

核友型号:st50002592

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
4
2pcs ~  $10.786
20pcs ~  $9.107
100pcs ~  $8.547
200pcs ~  $8.267
1,000pcs ~  $8.174
2,000pcs ~  $8.099


MOQ : 2
SPQ : 1

Detail

Approx. 12 days

核友型号:st61431227

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
1
1pcs ~  $20.092
10pcs ~  $16.359
50pcs ~  $15.613
100pcs ~  $15.053
500pcs ~  $14.679
1,000pcs ~  $14.605


MOQ : 1
SPQ : 1

Detail

Approx. 12 days

核友型号:st61431228

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches(2.54mm) 0.100inches(2.54mm) 10(1 x 10) Solder -55°C~125°C High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits. Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
1
1pcs ~  $20.092
10pcs ~  $16.359
50pcs ~  $15.613
100pcs ~  $15.053
500pcs ~  $14.679
1,000pcs ~  $14.605


MOQ : 1
SPQ : 1

Detail

Approx. 12 days

核友型号:st61431229

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches(2.54mm) 0.100inches(2.54mm) 20(1 x 20) Solder -55°C~125°C Closed Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
海外位置

XR2C-3211-N

RoHS
5
2pcs ~  $11.886
20pcs ~  $10.207
100pcs ~  $9.647
200pcs ~  $9.367
1,000pcs ~  $9.274
2,000pcs ~  $9.199


MOQ : 2
SPQ : 1

Detail

Approx. 12 days

核友型号:st50002593

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
海外位置

XR2P-1041
OMRON

RoHS
4
2pcs ~  $11.025
20pcs ~  $9.346
100pcs ~  $8.786
200pcs ~  $8.506
1,000pcs ~  $8.413
2,000pcs ~  $8.338


MOQ : 2
SPQ : 1

Detail

Approx. 12 days

核友型号:st50002594

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches(2.54mm) 0.100inches(2.54mm) 10(1 x 10) Solder -55°C~125°C High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits. Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff Hong Kong CoreStaff Thailand stock
海外位置

XR2P-2041

XR2P-2041
OMRON

RoHS
1
1pcs ~  $20.092
10pcs ~  $16.359
50pcs ~  $15.613
100pcs ~  $15.053
500pcs ~  $14.679
1,000pcs ~  $14.605


MOQ : 1
SPQ : 1

Detail

Approx. 12 days

核友型号:st50002595

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches(2.54mm) 0.100inches(2.54mm) 20(1 x 20) Solder -55°C~125°C High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits. Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
库存类别
供应商排名
供应商 库存所在位置 照片 型号 / 制造商 / 其他 库存量 生产批次 单价 最低订货数量 /
后续订购数量
预定出货日 ECAD模型 资讯
核友型号
Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
质量保证库存
質量保證
B-1
来自供应商的订
30  

Approx. 11 days

核友型号:st65482341

質量保證
B-1
来自供应商的订

1-2199298-2
TE CONNECTIVITY

200 22+  

Approx. 11 days

核友型号:st75023655

TE Connectivity Diplomate DL DIP、0.3inches(7.62mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 8(2 x 4) Solder -40°C~105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass/Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
来自供应商的订

1-2324271-3
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

Approx. 11 days

核友型号:st72738096

質量保證
B-1
来自供应商的订

1-2324271-4
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

Approx. 11 days

核友型号:st72738097

TE Connectivity LGA 4189 0.034inches(0.86mm) 0.039inches(1.00mm) 2092 Solder -25°C~100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoreversible
質量保證
B-1
来自供应商的订

1-390261-3
TE CONNECTIVITY

4,066  

Approx. 11 days

核友型号:st72143737

質量保證
B-1
来自供应商的订

1-822473-7
TE CONNECTIVITY

76  

Approx. 11 days

核友型号:st72143764

質量保證
B-1
来自供应商的订
413 19  

Approx. 11 days

核友型号:st65329491

MILL-MAX 110 DIP、0.3inches(7.62mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 8(2 x 4) Solder -55°C~125°C Open Frame Through Hole Tin Gold 200.0μin(5.08μm) 30.0μin(0.76μm) Brass Alloy Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester
質量保證
B-1
来自供应商的订

110-87-628-41-001101

139 NO INFO  

Approx. 10 days

核友型号:st65282553

PRECI-DIP 110 DIP、0.6inches(15.24mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 28(2 x 14) Solder -55°C~125°C Open Frame Through Hole Tin Gold Flash Brass Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester、ガラス充填
質量保證
B-1
来自供应商的订

2-2330550-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

Approx. 11 days

核友型号:st70632473

質量保證
B-1
来自供应商的订

2-2330551-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

Approx. 11 days

核友型号:st70632474

質量保證
B-1
来自供应商的订

2-2330553-1
TE CONNECTIVITY

1,600   MOQ : 32
SPQ : 1

Approx. 11 days

核友型号:st70632476

質量保證
B-1
来自供应商的订

2-5916783-5
TE CONNECTIVITY

360 2012  

Approx. 4 days

核友型号:st75013303

質量保證
B-1
日本供应商
40 2013  

Approx. 4 days

核友型号:st47622433

3M Textool? DIP、ZIF(ZIP)、0.6inches(15.24mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 28(2 x 14) Press Fit -55°C~125°C Closed Frame Connector Gold Gold 30.0μin(0.76μm) 30.0μin(0.76μm) Beryllium Copper Beryllium Copper Polysulfone (PSU), glass filled
質量保證
B-1
来自供应商的订

4-1571551-9
TE CONNECTIVITY

209 NO INFO  

Approx. 10 days

核友型号:st65283399

質量保證
B-1
来自供应商的订
20  

Approx. 11 days

核友型号:st65485092

質量保證
B-1
来自供应商的订

A81-A600X
SIEMENS

70 99  

Approx. 11 days

核友型号:st65401253

SIEMENS
質量保證
B-1
来自供应商的订

D01-9972042

D01-9972042
HARWIN

280 NO INFO  

Approx. 10 days

核友型号:st65285034

HARWIN D01-997 SIP 0.100inches(2.54mm) 0.100inches(2.54mm) 20(1 x 20) Solder -55°C~125°C Through Hole Tin Gold 196.9μin(5.00μm) Flash Brass Beryllium Copper Polycyclohexylene dimethylene terephthalate (PCT), polyester、ガラス充填
質量保證
B-1
来自供应商的订

PM-10
MAC8

4  

Approx. 4 days

核友型号:st63530587

MAC8
質量保證
B-1
日本供应商

XR2A-0801-N

10 2010  

Approx. 4 days

核友型号:st30382437

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
2 2019  

Approx. 4 days

核友型号:st42720655

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商

XR2A-1611-N

5  

Approx. 4 days

核友型号:st31354538

Omron Electronics Inc-EMC Div XR2 DIP、0.3inches(7.62mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 16(2 x 8) Solder -55°C~125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
日本供应商

XR2A-1611-N

18 2007  

Approx. 4 days

核友型号:st30353636

Omron Electronics Inc-EMC Div XR2 DIP、0.3inches(7.62mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 16(2 x 8) Solder -55°C~125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
日本供应商

XR2A-1621-N

42 2005  

Approx. 4 days

核友型号:st30353637

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
2 2017  

Approx. 4 days

核友型号:st39999247

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
10 2008  

Approx. 4 days

核友型号:st30353638

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商

XR2A-2011-N

56 2002  

Approx. 4 days

核友型号:st30353639

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
45 2006  

Approx. 4 days

核友型号:st30353641

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches(15.24mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 24(2 x 12) Solder -55°C~125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
日本供应商
34 2005  

Approx. 4 days

核友型号:st30353642

Omron Electronics Inc-EMC Div XR2 15.24 mm
質量保證
B-1
来自供应商的订
3 2005  

Approx. 4 days

核友型号:st60018582

Omron Electronics Inc-EMC Div XR2 7.62 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
30 2005  

Approx. 4 days

核友型号:st30353645

Omron Electronics Inc-EMC Div XR2 DIP、0.6inches(15.24mm)行間隔 0.100inches(2.54mm) 0.100inches(2.54mm) 28(2 x 14) Solder -55°C~125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
日本供应商
50 2011  

Approx. 4 days

核友型号:st30353646

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
3 2008  

Approx. 4 days

核友型号:st30353647

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
300  

Approx. 4 days

核友型号:st30382442

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
日本供应商
1 2017  

Approx. 4 days

核友型号:st30382443

Omron Electronics Inc-EMC Div XR2 15.24 mm High reliability including resistance to momentary interruptions. Ideal for high-speed data processing circuits.
質量保證
B-1
来自供应商的订
500 2018  

Approx. 4 days

核友型号:st60028544

Omron Electronics Inc-EMC Div XR2 SIP 0.100inches(2.54mm) 0.100inches(2.54mm) 20(1 x 20) Solder -55°C~125°C Closed Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
日本供应商
1 2016  

Approx. 4 days

核友型号:st39999248

Omron Electronics Inc-EMC Div XR2 15.24 mm
授權代理店
A-1
来自供应商的订

1825046-2
TE CONNECTIVITY

40  

Approx. 5 days

核友型号:st62535567

授權代理店
A-1
来自供应商的订

643648-1
TE CONNECTIVITY

138  

Approx. 5 days

核友型号:st68855655

Recommended Rectifiers - IC/transistor sockets