Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

点击数:1061~  /   型号:  /   库存类别:全部  /   数量:0PCS~

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库存类别
供应商排名
供应商 库存所在位置 照片 型号 / 制造商 / 其他 库存量 生产批次 单价 最低订货数量 /
后续订购数量
预定出货日 ECAD模型 资讯
核友型号
Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
授權代理店
A-2
corestaff CoreStaff Thailand stock

XR2A-2011-N

5 N/A
3pcs ~  $6.904
30pcs ~  $6.151
150pcs ~  $5.586
300pcs ~  $5.21
1,500pcs ~  $5.135
3,000pcs ~  $5.078


MOQ : 3
SPQ : 1

Detail

預計 12個工作天

核友型号:st61431223

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
授權代理店
A-2
corestaff CoreStaff Thailand stock
5 N/A
4pcs ~  $5.62
40pcs ~  $5.338
200pcs ~  $4.773
400pcs ~  $4.397
2,000pcs ~  $4.35
4,000pcs ~  $4.322


MOQ : 4
SPQ : 1

Detail

預計 12個工作天

核友型号:st61431224

Omron Electronics Inc-EMC Div XR2 7.62 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
授權代理店
A-2
corestaff CoreStaff Thailand stock
海外位置
RoHS
10 N/A
3pcs ~  $7.86
30pcs ~  $7.107
150pcs ~  $6.543
300pcs ~  $6.166
1,500pcs ~  $6.091
3,000pcs ~  $6.035


MOQ : 3
SPQ : 1

Detail

預計 12個工作天

核友型号:st50002590

Omron Electronics Inc-EMC Div XR2 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 24 (2 x 12) Solder -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff CoreStaff Thailand stock

XR2A-2811-N

15 N/A
3pcs ~  $8.339
30pcs ~  $7.586
150pcs ~  $7.021
300pcs ~  $6.645
1,500pcs ~  $6.569
3,000pcs ~  $6.513


MOQ : 3
SPQ : 1

Detail

預計 12個工作天

核友型号:st61431226

Omron Electronics Inc-EMC Div XR2 15.24 mm
授權代理店
A-2
corestaff CoreStaff Thailand stock
海外位置
RoHS
1 N/A
1pcs ~  $20.139
10pcs ~  $16.375
50pcs ~  $15.622
100pcs ~  $15.057
500pcs ~  $14.681
1,000pcs ~  $14.606


MOQ : 1
SPQ : 1

Detail

預計 12個工作天

核友型号:st50002591

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
授權代理店
A-2
corestaff CoreStaff Thailand stock
海外位置
RoHS
5 N/A
2pcs ~  $12.293
20pcs ~  $11.352
100pcs ~  $10.599
200pcs ~  $10.034
1,000pcs ~  $9.752
2,000pcs ~  $9.658


MOQ : 2
SPQ : 1

Detail

預計 12個工作天

核友型号:st50002592

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
授權代理店
A-2
corestaff CoreStaff Thailand stock
4 N/A
2pcs ~  $10.571
20pcs ~  $8.877
100pcs ~  $8.312
200pcs ~  $8.03
1,000pcs ~  $7.936
2,000pcs ~  $7.861


MOQ : 2
SPQ : 1

Detail

預計 12個工作天

核友型号:st61431227

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
授權代理店
A-2
corestaff CoreStaff Thailand stock
1 N/A
1pcs ~  $20.139
10pcs ~  $16.375
50pcs ~  $15.622
100pcs ~  $15.057
500pcs ~  $14.681
1,000pcs ~  $14.606


MOQ : 1
SPQ : 1

Detail

預計 12個工作天

核友型号:st61431228

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 10 (1 x 10) Solder -55°C ~ 125°C 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適 Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff CoreStaff Thailand stock
1 N/A
1pcs ~  $20.139
10pcs ~  $16.375
50pcs ~  $15.622
100pcs ~  $15.057
500pcs ~  $14.681
1,000pcs ~  $14.606


MOQ : 1
SPQ : 1

Detail

預計 12個工作天

核友型号:st61431229

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 20 (1 x 20) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Beryllium Copper Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff CoreStaff Thailand stock
海外位置

XR2C-3211-N

RoHS
5 N/A
2pcs ~  $13.249
20pcs ~  $12.308
100pcs ~  $11.555
200pcs ~  $10.991
1,000pcs ~  $10.708
2,000pcs ~  $10.614


MOQ : 2
SPQ : 1

Detail

預計 12個工作天

核友型号:st50002593

Omron Electronics Inc-EMC Div XR2 15.24 mm 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適
授權代理店
A-2
corestaff CoreStaff Thailand stock
海外位置

XR2P-1041
OMRON

RoHS
4 N/A
2pcs ~  $12.245
20pcs ~  $11.304
100pcs ~  $10.551
200pcs ~  $9.986
1,000pcs ~  $9.704
2,000pcs ~  $9.61


MOQ : 2
SPQ : 1

Detail

預計 12個工作天

核友型号:st50002594

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 10 (1 x 10) Solder -55°C ~ 125°C 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適 Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
授權代理店
A-2
corestaff CoreStaff Thailand stock
海外位置

XR2P-2041

XR2P-2041
OMRON

RoHS
1 N/A
1pcs ~  $26.881
10pcs ~  $23.117
50pcs ~  $22.364
100pcs ~  $21.799
500pcs ~  $21.423
1,000pcs ~  $21.348


MOQ : 1
SPQ : 1

Detail

預計 12個工作天

核友型号:st50002595

Omron Electronics Inc-EMC Div XR2 SIP 0.100" (2.54mm) 0.100" (2.54mm) 20 (1 x 20) Solder -55°C ~ 125°C 瞬断に強いなど高信頼性を実現。高速データ処理回路に最適 Threaded Gold Gold 10.0μin(0.25μm) 10.0μin(0.25μm) Brass Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
库存类别
供应商排名
供应商 库存所在位置 照片 型号 / 制造商 / 其他 库存量 生产批次 单价 最低订货数量 /
后续订购数量
预定出货日 ECAD模型 资讯
核友型号
Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
质量保证库存
質量保證
B-1
来自供应商的订

1-1814655-1

1-1814655-1
TE CONNECTIVITY

12  

預計 11個工作天

核友型号:st75086374

TE CONNECTIVITY SIP 0.100" (2.54mm) 0.100" (2.54mm) 16 (1 x 16) Solder -55°C ~ 125°C Closed Frame Through Hole Tin Gold 196.9μin(5.00μm) Flash Brass Beryllium Copper Thermoplastic, Polyester
質量保證
B-1
来自供应商的订
30  

預計 11個工作天

核友型号:st65482341

質量保證
B-1
来自供应商的订

1-2199298-2
TE CONNECTIVITY

200 22+  

預計 11個工作天

核友型号:st75023655

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 8 (2 x 4) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
来自供应商的订

1-2199298-2
TE CONNECTIVITY

1  

預計 11個工作天

核友型号:st75087388

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 8 (2 x 4) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
来自供应商的订

1-2199298-8
TE CONNECTIVITY

18  

預計 11個工作天

核友型号:st75087389

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 24 (2 x 12) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
来自供应商的订

1-2199298-9
TE CONNECTIVITY

5  

預計 11個工作天

核友型号:st75087390

TE CONNECTIVITY Diplomate DL DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -40°C ~ 105°C Open Frame Through Hole Tin Tin 60.0μin(1.52μm) Brass, Copper Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
質量保證
B-1
来自供应商的订

1-2324271-3
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

預計 11個工作天

核友型号:st72738096

質量保證
B-1
来自供应商的订

1-2324271-4
TE CONNECTIVITY

840   MOQ : 12
SPQ : 1

預計 11個工作天

核友型号:st72738097

TE CONNECTIVITY LGA 4189 0.034" (0.86mm) 0.039" (1.00mm) 2092 Solder -25°C ~ 100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

1-2324271-4
TE CONNECTIVITY

5  

預計 11個工作天

核友型号:st75087536

TE CONNECTIVITY LGA 4189 0.034" (0.86mm) 0.039" (1.00mm) 2092 Solder -25°C ~ 100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

1-390261-3
TE CONNECTIVITY

4,066  

預計 11個工作天

核友型号:st72143737

質量保證
B-1
来自供应商的订

1-822473-7
TE CONNECTIVITY

76  

預計 11個工作天

核友型号:st72143764

質量保證
B-1
来自供应商的订
10  

預計 11個工作天

核友型号:st75084775

MOLEX 3099 0.198" (5.03mm) Solder Board Guide Through Hole Tin Tin 200.0µin (5.08µm)
質量保證
B-1
来自供应商的订
12  

預計 11個工作天

核友型号:st75084776

MOLEX 3099 0.198" (5.03mm) Solder Board Guide Through Hole Tin Tin 200.0µin (5.08µm)
質量保證
B-1
来自供应商的订
413 19  

預計 11個工作天

核友型号:st65329491

MILL-MAX 110 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 8 (2 x 4) Solder -55°C ~ 125°C Open Frame Through Hole Tin Gold 200.0μin(5.08μm) 30.0μin(0.76μm) Brass Alloy Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
質量保證
B-1
来自供应商的订

1554653-1
TE CONNECTIVITY

5  

預計 11個工作天

核友型号:st75089611

TE CONNECTIVITY LGA 2011(47 x 58) Solder -25°C ~ 100°C Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

1571552-2
TE CONNECTIVITY

8  

預計 11個工作天

核友型号:st75089701

質量保證
B-1
来自供应商的订

1571552-6
TE CONNECTIVITY

10  

預計 11個工作天

核友型号:st75089702

質量保證
B-1
来自供应商的订

1814655-5
TE CONNECTIVITY

10  

預計 11個工作天

核友型号:st75092696

TE CONNECTIVITY SIP 0.100" (2.54mm) 0.100" (2.54mm) 10 (1 x 10) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 29.5μin(0.75μm) 29.5μin(0.75μm) Brass Beryllium Copper Thermoplastic, Polyester
質量保證
B-1
来自供应商的订

2-1571550-4

2-1571550-4
TE CONNECTIVITY

11  

預計 11個工作天

核友型号:st75096000

TE CONNECTIVITY 500 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 16 (2 x 8) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 25.0μin(0.63μm) 25.0μin(0.63μm) Beryllium Copper Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
質量保證
B-1
来自供应商的订

2-1571550-9
TE CONNECTIVITY

5  

預計 11個工作天

核友型号:st75096001

TE CONNECTIVITY 500 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -55°C ~ 125°C Closed Frame Through Hole Gold Gold 25.0μin(0.63μm) 25.0μin(0.63μm) Beryllium Copper Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
質量保證
B-1
来自供应商的订

2-1571552-6

2-1571552-6
TE CONNECTIVITY

11  

預計 11個工作天

核友型号:st75096003

質量保證
B-1
来自供应商的订

2-1571586-9
TE CONNECTIVITY

11  

預計 11個工作天

核友型号:st75096004

TE CONNECTIVITY 800 DIP, 0.6" (15.24mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 28 (2 x 14) Solder -55°C ~ 105°C Open Frame Through Hole Gold Gold 25.0μin(0.63μm) 25.0μin(0.63μm) 銅 Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
質量保證
B-1
来自供应商的订

2-2129710-5
TE CONNECTIVITY

1  

預計 11個工作天

核友型号:st75096511

TE CONNECTIVITY LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin(0.76μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

2-2129710-6
TE CONNECTIVITY

2  

預計 11個工作天

核友型号:st75096512

TE CONNECTIVITY LGA 3647 Solder Open Frame Surface Mount Gold 30.0μin(0.76μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

2-2330550-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

預計 11個工作天

核友型号:st70632473

質量保證
B-1
来自供应商的订

2-2330551-1
TE CONNECTIVITY

1  

預計 11個工作天

核友型号:st75096728

質量保證
B-1
来自供应商的订

2-2330551-1
TE CONNECTIVITY

400   MOQ : 10
SPQ : 1

預計 11個工作天

核友型号:st70632474

質量保證
B-1
来自供应商的订

2-2330553-1
TE CONNECTIVITY

1,600   MOQ : 32
SPQ : 1

預計 11個工作天

核友型号:st70632476

質量保證
B-1
来自供应商的订

2134439-2
TE CONNECTIVITY

4  

預計 11個工作天

核友型号:st75095741

質量保證
B-1
来自供应商的订

2134440-3
TE CONNECTIVITY

4  

預計 11個工作天

核友型号:st75095742

質量保證
B-1
来自供应商的订

2201838-1
TE CONNECTIVITY

3  

預計 11個工作天

核友型号:st75096380

TE CONNECTIVITY LGA 0.035" (0.90mm) 0.040" (1.02mm) 2011(47 x 58) Solder Open Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

2201838-2
TE CONNECTIVITY

3  

預計 11個工作天

核友型号:st75096381

質量保證
B-1
来自供应商的订

2287402-1
TE CONNECTIVITY

10  

預計 11個工作天

核友型号:st75096836

TE CONNECTIVITY LGA 0.036" (0.91mm) 0.036" (0.91mm) 1151 Solder Closed Frame Surface Mount Gold Gold 15.0μin(0.38μm) 15.0μin(0.38μm) Copper Alloy Copper Alloy Thermoplastic
質量保證
B-1
来自供应商的订

2299806-1
TE CONNECTIVITY

6  

預計 11個工作天

核友型号:st75096921

質量保證
B-1
来自供应商的订

3-1571552-6

3-1571552-6
TE CONNECTIVITY

10  

預計 11個工作天

核友型号:st75100181

質量保證
B-1
来自供应商的订

4-1571552-2
TE CONNECTIVITY

10  

預計 11個工作天

核友型号:st75102772

TE CONNECTIVITY 800 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 14 (2 x 7) Solder -55°C ~ 105°C Open Frame Through Hole Gold Gold 20.0μin(0.51μm) 20.0μin(0.51μm) 銅 Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

Recommended Rectifiers - IC/transistor sockets