Manufacturer Series Type Pitch - Post Pitch - Mating Number of Positions or Pins (Grid) Termination Operating Temperature Range Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post

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Manufacturer Series Type Pitch - Post Pitch - Mating Product Overview Number of Positions or Pins (Grid) Termination Operating Temperature Range Features Applications Automotive Mounting Type Contact Finish - Post Contact Finish - Mating Contact Finish Thickness - Post Contact Finish Thickness - Mating Contact Material - Post Contact Material - Mating Housing Material
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06-0503-21
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0503-21-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
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06-0503-30
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0503-30-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Wire Wrap - - Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
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06-0503-31
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0503-31-ND@0

Aries Electronics 0503 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Wire Wrap - - Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA), Nylon, Glass Filled
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06-0508-20
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0508-20-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 6 (1 x 6) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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06-0508-21
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0508-21-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 6 (1 x 6) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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06-0508-30
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0508-30-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 6 (1 x 6) Wire Wrap -55°C ~ 105°C - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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06-0508-31
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0508-31-ND@0

Aries Electronics 508 SIP - 0.100" (2.54mm) 6 (1 x 6) Wire Wrap -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
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06-0511-10
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6 (1 x 6) Pos SIP Socket Tin Through Hole
核友型号:zp2216-06-0511-10-ND@0

Aries Electronics 511 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder -55°C ~ 105°C - Through Hole Tin Tin 50.0µin (1.27µm) 50.0µin (1.27µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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06-0511-11
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0511-11-ND@0

Aries Electronics 511 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder -55°C ~ 125°C - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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06-0513-10
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0513-10-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-0513-10H
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0513-10H-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0513-10T

06-0513-10T
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-A769AR-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - - Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-0513-11
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0513-11-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-0513-11H
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0513-11H-ND@0

Aries Electronics 0513 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - - Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-0517-90C
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6 (1 x 6) Pos SIP Socket Gold Through Hole, Right Angle
核友型号:zp2216-06-0517-90C-ND@0

Aries Electronics 0517 SIP - - 6 (1 x 6) Solder - - Through Hole, Right Angle Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0518-00
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6 (1 x 6) Pos SIP Socket Gold Surface Mount
核友型号:zp2216-06-0518-00-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - Open Frame Surface Mount Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0518-10

06-0518-10
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-A771AR-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0518-10H

06-0518-10H
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-A770AR-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0518-10T
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0518-10T-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0518-11
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0518-11-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-0518-11H
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6 (1 x 6) Pos SIP Socket Gold Through Hole
核友型号:zp2216-06-0518-11H-ND@0

Aries Electronics 518 SIP 0.100" (2.54mm) 0.100" (2.54mm) 6 (1 x 6) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-1508-20
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1508-20-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

06-1508-21
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1508-21-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

06-1508-30
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1508-30-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

06-1508-31
ARIES ELECTRONICS

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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1508-31-ND@0

Aries Electronics 508 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6
Partner Stock

06-1518-00
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Surface Mount
核友型号:zp2216-06-1518-00-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Surface Mount Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-1518-10
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1518-10-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-1518-10H
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1518-10H-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-1518-10T
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1518-10T-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-1518-11
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1518-11-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-1518-11H
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-1518-11H-ND@0

Aries Electronics 518 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder - Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2503-20
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2503-20-ND@0

Aries Electronics 503 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2503-21
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2503-21-ND@0

Aries Electronics 503 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2503-30
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2503-30-ND@0

Aries Electronics 503 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2503-31
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2503-31-ND@0

Aries Electronics 503 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2513-10
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2513-10-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2513-10H
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2513-10H-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2513-10T
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2513-10T-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2513-11
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2513-11-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-2513-11H
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6 (2 x 3) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-2513-11H-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.2" (5.08mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3503-20
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3503-20-ND@0

Aries Electronics 503 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3503-21
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3503-21-ND@0

Aries Electronics 503 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3503-30
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3503-30-ND@0

Aries Electronics 503 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3503-31
ARIES ELECTRONICS

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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3503-31-ND@0

Aries Electronics 503 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Closed Frame Through Hole Gold Gold 10.0µin (0.25µm) 10.0µin (0.25µm) Phosphor Bronze Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3508-20
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3508-20-ND@0

Aries Electronics 508 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
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06-3508-21
ARIES ELECTRONICS

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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3508-21-ND@0

Aries Electronics 508 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3508-30
ARIES ELECTRONICS

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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3508-30-ND@0

Aries Electronics 508 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 105°C Open Frame Through Hole Tin Gold 200.0µin (5.08µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3508-31
ARIES ELECTRONICS

RoHS
   

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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3508-31-ND@0

Aries Electronics 508 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Wire Wrap -55°C ~ 125°C Open Frame Through Hole Gold Gold 10.0µin (0.25µm) 30.0µin (0.76µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3513-10

06-3513-10
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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-A772AR-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
Partner Stock

06-3513-10T
ARIES ELECTRONICS

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6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
核友型号:zp2216-06-3513-10T-ND@0

Aries Electronics Lo-PRO®file, 513 DIP, 0.3" (7.62mm) Row Spacing 0.100" (2.54mm) 0.100" (2.54mm) 6 (2 x 3) Solder -55°C ~ 105°C Closed Frame Through Hole Tin Gold 200.0µin (5.08µm) 10.0µin (0.25µm) Brass Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled

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