UDZSTE-1727B
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文件
商品說明
| Contact Plating | Copper, Silver, Tin |
| Element Configuration | Single |
| Height | 700 µm |
| Impedance | 110 Ω |
| Lead Free | Lead Free |
| Max Operating Temperature | 150 °C |
| Max Power Dissipation | 200 mW |
| Max Reverse Leakage Current | 100 nA |
| Min Operating Temperature | -55 °C |
| Mount | Surface Mount |
| Number of Pins | 2 |
| Packaging | Cut Tape |
| Peak Reverse Current | 100 mA |
| Power Dissipation | 200 mW |
| Power Rating | 200 mW |
| Radiation Hardening | No |
| REACH SVHC | No |
| Termination | SMD/SMT |
| Test Current | 5 mA |
| Tolerance | 3 % |
| Voltage Rating (DC) | 27 V |
| Voltage Tolerance | 2 % |
| Width | 1.25 mm |
| Working Voltage | 27 V |
| Zener Current | 5 mA |
| Zener Voltage | 2.7 V |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
庫存量: 3,000
MOQ:1,425
SPQ:1
| 購買數量 | 單價(FOB JAPAN) |
|---|---|
| 1,425 - | $0.051 |
| - | - |
| - | - |
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