BZM55C3V9-TR
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文件
商品說明
| Breakdown Voltage | 4.1 V |
| Case/Package | SMD/SMT |
| Contact Plating | Silver, Tin |
| Element Configuration | Single |
| ESD Protection | No |
| Height | 1.2 mm |
| Impedance | 90 Ω |
| Max Operating Temperature | 175 °C |
| Max Power Dissipation | 500 mW |
| Max Reverse Leakage Current | 2 µA |
| Min Operating Temperature | -65 °C |
| Mount | Surface Mount |
| Number of Pins | 2 |
| Packaging | Cut Tape |
| Power Dissipation | 500 mW |
| Radiation Hardening | No |
| REACH SVHC | No |
| Test Current | 5 mA |
| Voltage Tolerance | 5 % |
| Width | 1.2 mm |
| Zener Voltage | 3.9 V |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
庫存量: 5,000
MOQ:2,500
SPQ:2,500
| 購買數量 | 單價(FOB JAPAN) |
|---|---|
| 2,500 - 4,999 | $0.051 |
| 5,000 - 7,499 | $0.049 |
| 7,500 - 12,499 | $0.048 |
| 12,500 - 24,999 | $0.048 |
| 25,000 - | $0.047 |
| - | - |
| - | - |
| - | - |
