RNC55H7501BSB14
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文件
商品說明
| Case/Package | Conformal |
| Composition | Metal Film |
| Contact Plating | Lead, Tin |
| Diameter | 2.39 mm |
| Failure Rate | 0.001 % |
| Features | Military, Moisture Resistant, Weldable |
| Lead Free | Contains Lead |
| Max Operating Temperature | 175 °C |
| Max Power Dissipation | 125 mW |
| Military Standard | MIL-PRF-55182 |
| Min Operating Temperature | -65 °C |
| Mount | Through Hole |
| Number of Terminations | 2 |
| Packaging | Bulk |
| Power Rating | 125 mW |
| Radiation Hardening | No |
| Resistance | 7.5 kΩ |
| Temperature Coefficient | 50 ppm/°C |
| Termination | Axial |
| Tolerance | 0.1 % |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
庫存量: 800
MOQ:31
SPQ:1
| 購買數量 | 單價(FOB JAPAN) |
|---|---|
| 31 - 120 | $2.44 |
| 121 - 347 | $2.01 |
| 348 - | $1.83 |
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| - | - |
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