BZM55C3V9-TR
當本公司管有此產品的不同批次時、產品的外觀及包裝並不一定如以上圖像所示。
如欲了解詳情、請點擊上面「查詢詳情」與我們聯絡。
文件
商品說明
| Breakdown Voltage | 4.1 V |
| Case/Package | SMD/SMT |
| Contact Plating | Silver, Tin |
| Element Configuration | Single |
| ESD Protection | No |
| Height | 1.2 mm |
| Impedance | 90 Ω |
| Max Operating Temperature | 175 °C |
| Max Power Dissipation | 500 mW |
| Max Reverse Leakage Current | 2 µA |
| Min Operating Temperature | -65 °C |
| Mount | Surface Mount |
| Number of Pins | 2 |
| Packaging | Cut Tape |
| Power Dissipation | 500 mW |
| Radiation Hardening | No |
| REACH SVHC | No |
| Test Current | 5 mA |
| Voltage Tolerance | 5 % |
| Width | 1.2 mm |
| Zener Voltage | 3.9 V |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
庫存量: 5,530
MOQ:1,780
SPQ:1
| 購買數量 | 單價(FOB JAPAN) |
|---|---|
| 1,780 - | $0.041 |
| - | - |
| - | - |
| - | - |
| - | - |
| - | - |
| - | - |
| - | - |
