HCPL0201
AVAGO TECHNOLOGIES
Images are for reference only.
Please see Product Specifications
for details.
Documents
Product Specifications
| Case/Package | SOIC |
| Contact Plating | Lead, Tin |
| Data Rate | 5 Mbps |
| Direction | Unidirectional |
| Fall Time | 7 ns |
| Forward Current | 10 mA |
| Forward Voltage | 1.7 V |
| Isolation Voltage | 3.75 kV |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85 °C |
| Max Output Current | 25 mA |
| Max Power Dissipation | 210 mW |
| Min Operating Temperature | -40 °C |
| Mount | Surface Mount |
| Number of Channels | 1 |
| Number of Elements | 1 |
| Number of Pins | 8 |
| Output Current | 25 mA |
| Output Current per Channel | 25 mA |
| Power Dissipation | 210 mW |
| Propagation Delay | 300 ns |
| Radiation Hardening | No |
| Reverse Breakdown Voltage | 5 V |
| Rise Time | 30 ns |
| Turn-On Delay Time | 300 ns |
・This information is intended to provide a brief overview of the item.
・For a more comprehensive explanation of this product, please refer to the manufacturer's
official data sheet.
